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机译:高性能互补金属氧化物半导体器件中硅化镍不连续性形成机理的研究
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan,Department of Information Systems Engineering, Graduate School of Information Science and Technology, Osaka University, Suita, Osaka 565-0871, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Renesas Electronics Corporation, Itami, Hyogo 664-0005, Japan;
Department of Information Systems Engineering, Graduate School of Information Science and Technology, Osaka University, Suita, Osaka 565-0871, Japan;
机译:等离子体能量图分析互补金属氧化物半导体器件中硅化镍的相态
机译:绝缘体上硅衬底用于纳米级互补金属氧化物半导体场效应晶体管器件的硅化镍热稳定性研究
机译:双金属栅极技术,具有金属插入的全硅化物叠层和富镍的全硅化物栅电极,使用单个富镍的全硅化物相用于规模化的高k互补金属氧化物半导体场效应晶体管
机译:高性能CMOS器件中硅化镍不连续性的形成机理研究
机译:通过点接触反应,纳米硅器件的镍硅/硅/硅镍和铂硅/硅/铂硅纳米线异质结构形成纳米硅化物。
机译:室温合成钴-锰-草酸镍微多面体用于高性能柔性电化学储能装置
机译:用于微系统器件的由蒸发和溅射镍形成的硅化镍的成分分析