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Nanobonding: A key technology for emerging applications in health and environmental sciences

机译:纳米键:健康和环境科学领域新兴应用的关键技术

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摘要

In this paper, surface-activation-based nanobonding technology and its applications are described. This bonding technology allows for the integration of electronic, photonic, fluidic and mechanical components into small form-factor systems for emerging sensing and imaging applications in health and environmental sciences. Here, we describe four different nanobonding techniques that have been used for the integration of various substrates-silicon, gallium arsenide, glass, and gold. We use these substrates to create electronic (silicon), photonic (silicon and gallium arsenide), microelectromechanical (glass and silicon), and fluidic (silicon and glass) components for biosensing and bioimaging systems being developed. Our nanobonding technologies provide void-free, strong, and nanometer scale bonding at room temperature or at low temperatures (<200 ℃), and do not require chemicals, adhesives, or high external pressure. The interfaces of the nanobonded materials in ultra-high vacuum and in air correspond to covalent bonds, and hydrogen or hydroxyl bonds, respectively.
机译:在本文中,描述了基于表面活化的纳米键合技术及其应用。这种结合技术可以将电子,光子,流体和机械组件集成到小型的系统中,以用于健康和环境科学中新兴的传感和成像应用。在这里,我们描述了四种不同的纳米键合技术,这些技术已用于集成各种基材-硅,砷化镓,玻璃和金。我们使用这些基板来创建电子(硅),光子(硅和砷化镓),微机电(玻璃和硅)以及流体(硅和玻璃)组件,以用于正在开发的生物传感和生物成像系统。我们的纳米键合技术可在室温或低温(<200℃)下提供无空隙,牢固且纳米级的键合,并且不需要化学药品,粘合剂或高外部压力。纳米键合材料在超高真空和空气中的界面分别对应于共价键和氢或羟基键。

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  • 来源
    《Japanese journal of applied physics》 |2015年第3期|030201.1-030201.10|共10页
  • 作者单位

    Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada;

    Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada,Electronic and Computer Engineering Department, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong;

    Department of Precision Engineering, School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan;

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