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Electrochemical study on metal corrosion in chemical mechanical planarization process

机译:化学机械平面化过程中金属腐蚀的电化学研究

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Typical metal corrosions caused by the chemical mechanical planarization (CMP) process are discussed in this review paper. By categorizing them into seven kinds of corrosion, namely, chemical corrosion, crevice corrosion, crystal-orientation-dependent corrosion, narrow trench corrosion, photocorrosion, galvanic corrosion, and electrostatic-charge induced corrosion, we discuss their mechanisms and how to suppress them on the basis of electrochemical studies. Moreover, we demonstrate the usefulness of three-dimensional pH-potential diagrams for predicting corrosion issues in an actual CMP process. (C) 2017 The Japan Society of Applied Physics
机译:本文将讨论由化学机械平面化(CMP)工艺引起的典型金属腐蚀。通过将它们分为化学腐蚀,缝隙腐蚀,与晶体取向有关的腐蚀,窄沟槽腐蚀,光腐蚀,电流​​腐蚀和静电荷诱发的腐蚀七种腐蚀,我们讨论了它们的机理以及如何抑制它们。电化学研究的基础。此外,我们证明了三维pH势图对于预测实际CMP工艺中的腐蚀问题的有用性。 (C)2017日本应用物理学会

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