Finite Element Simulation and Experimental Investigation of Hot Embossing of Thin Polymer Film

摘要

The modelling of the hot embossing process requires accurate determination of the polymer flows. The present work is focussed on experiments and numerical simulations of the hot embossing processes consisting in the replication of polymers plates on engraved shapes in the metallic plates that are used for the tests. In the proposed analysis consisting of the micro-indentation of the polymer plate, axisymmetrical and 2D FE models are used to analyse the cavity filling capabilities vs. strain rates, strains and temperature contours. The numerical simulation results show that profile deformation is largely influenced by the forming pressure and temperature, velocity of movement of upper plate and fluidity of the polymer during the embossing step. These results showed also the flow behaviour of COC inside the mould during hot embossing process. This may assist future improvement of manufacturing quality and production throughput. Hot embossing experiments were also conducted and the results obtained were compared with the simulated ones. The predicted workpiece geometry shows good agreement with experimental result. It is found that the finite element simulation results are in reasonable agreement with the experimental observation.