Cure Kinetics and Thermal Properties of Octa(aminophenyl)-POSS/Bromobisphenol A Epoxy Resin Nanocomposites

摘要

The tetrabromobisphenol A epoxy resin (TBBPAER) was synthesized and Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP-POSS) was used as a curing reagent of TBBPAER. The cure kinetics, the glass transition temperature, and the flame resistance of OAP-POSS/TBBPAER nanocomposites were investigated. The results show that the curing reaction could be described by the autocatalytic Šesták-Berggren (S-B) model. The average activation energy E _a is 129.59 KJ/mol, the maximal mechanical loss temperature (T _p) is 166°C, when the molar ratio (N _s) of amino group to epoxy group is 0.5. The oxygen index for fire resistance is 46  49 for different amounts of OAP-POSS.View full textDownload full textKeywordsbromo epoxy resin, cure kinetics, fire resistance, silsesquioxanes, thermal propertiesRelated var addthis_config = { ui_cobrand: "Taylor & Francis Online", services_compact: "citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,more", pubid: "ra-4dff56cd6bb1830b" }; Add to shortlist Link Permalink http://dx.doi.org/10.1080/00914037.2011.617331