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Scalability And Parallel Execution Of Warp Processing: Dynamic Hardware/software Partitioning

机译:变形处理的可伸缩性和并行执行:动态硬件/软件分区

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Warp processors are a novel architecture capable of autonomously optimizing an executing application by dynamically re-implementing critical kernels within the software as custom hardware circuits in an on-chip FPGA. Previous research on warp processing focused on low-power embedded systems, incorporating a low-end ARM processor as the main software execution resource. We provide a thorough analysis of the scalability of warp processing by evaluating several possible warp processor implementations, from low-power to high-performance, and by evaluating the potential for parallel execution of the partitioned software and hardware. We further demonstrate that even considering a high-performance 1 GHz embedded processor, warp processing provides the equivalent performance of a 2.4 GHz processor. By further enabling parallel execution between the processes and FPGA, the parallel warp processor execution provides the equivalent performance of a 3.2 GHz processor.
机译:Warp处理器是一种新颖的体系结构,能够通过动态重新实现软件中的关键内核作为片上FPGA中的自定义硬件电路,来自主优化执行的应用程序。先前对翘曲处理的研究集中于低功耗嵌入式系统,将低端ARM处理器作为主要软件执行资源。我们通过评估从低功率到高性能的几种可能的翘曲处理器实施方案,以及评估分区软件和硬件并行执行的潜力,对翘曲处理的可伸缩性进行了全面的分析。我们进一步证明,即使考虑使用高性能1 GHz嵌入式处理器,翘曲处理也可以提供与2.4 GHz处理器相当的性能。通过进一步实现进程与FPGA之间的并行执行,并行扭曲处理器执行可提供与3.2 GHz处理器相当的性能。

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