Chip-Package Co-Design of a 4.7 GHz VCO

摘要

Future wireless communication applications require low-power and highly integrated transceiver solution. The integration of the RF front-ent poses a great challenge, in particular, as traditional implementations reqire a large number of external passive Components. " Single-package" integration of complete transceivers based on an MCM-D technology with integrated passives is Presented in this paper as a superior alternative to overcome the many problems of single-chip CMOS integration.