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首页> 外文期刊>Journal of Microelectronics and Electronic Packaging >LTCC Based Microf luidic Mass Flow Sensor Concept
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LTCC Based Microf luidic Mass Flow Sensor Concept

机译:基于LTCC的微流体质量流量传感器概念

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Low temperature coflred ceramics (LTCC) is established as a widespread platform for advanced functional ceramic circuits in many different applications, such as space, aviation, medical, and sensor technology. MLC (multi layer ceramics) based systems allow the integration of passive components, which leads to a high integration level. For microfluidic devices, the integration of 3D structures such as channels and chambers is necessary. Using LTCC will lead to integrating sensor elements due to high reliability, the good ceramic characteristics, and excellent physical properties. To realize 3D micro-channels beyond the laboratory, adequate manufacturing processes are essential. This study proposes the realization of microfluidic channels and shows in which ways these can be realized by a range of newly developed manufacturing methods during the LTCC process. A benchmark of 3D laser structuring and two cold embossing technologies were investigated to show the benefits and also the limits of each technology. The sensor elements, which were directly integrated into the LTCC body, are based on PTC and resistor materials realized in thick film technology. The excellent performance of a microfluidic LTCC system will be shown based on a manufactured demonstrator. The final conclusion is that these established manufacturing and integration methods offer remarkable potential to meet the requirements for future circuit designs, where actual design concepts cannot solve all issues, in particular where harsh environmental conditions occur or a high integration concept is mandatory.
机译:低温弯曲陶瓷(LTCC)被建立为广泛应用的平台,用于许多不同应用中的高级功能陶瓷电路,例如太空,航空,医疗和传感器技术。基于MLC(多层陶瓷)的系统允许无源组件的集成,这导致了很高的集成度。对于微流体设备,必须集成3D结构(例如通道和腔室)。由于高可靠性,良好的陶瓷特性和出色的物理性能,使用LTCC将导致集成传感器元件。为了在实验室之外实现3D微通道,必须有足够的制造工艺。这项研究提出了微流体通道的实现,并显示了在LTCC过程中可以通过一系列新开发的制造方法来实现这些方法。对3D激光结构化和两种冷压花技术的基准进行了研究,以显示每种技术的好处以及局限性。直接集成到LTCC主体中的传感器元件基于PTC和以厚膜技术实现的电阻器材料。基于制造的演示器,将显示出微流体LTCC系统的出色性能。最后的结论是,这些成熟的制造和集成方法具有巨大的潜力,可以满足未来电路设计的需求,因为实际的设计概念无法解决所有问题,特别是在出现恶劣的环境条件或必须采用高度集成的概念的情况下。

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