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首页> 外文期刊>International Journal of Microcircuits & Electronic Packaging >High Temperature Characterization up to 450℃ of MOSFETs and Basic Circuits Realized in a Silicon-on-Insulator (SOI) CMOS Technology
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High Temperature Characterization up to 450℃ of MOSFETs and Basic Circuits Realized in a Silicon-on-Insulator (SOI) CMOS Technology

机译:采用绝缘体上硅(SOI)CMOS技术实现的MOSFET和基本电路的高温特性高达450℃

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摘要

Standard bulk CMOS technology targets operating temperatures of not more than 175℃. Silicon-on-insulator technologies are commonly used up to 250℃. In this work, we evaluate the limit for electronic circuit function realized in thin film SOI technologies for even higher temperatures. At Fraunhofer IMS, a versatile 1.0 μm SOI-CMOS process based on 200 mm wafers is available. It features three layers of tungsten metallization with excellent reliability concerning electromigration, as well as voltage-independent capacitors, various resistors, and single-poly-EEPROMs. We present a study of the temperature dependence of MOSFETs and basic circuits produced in this process. The electrical characteristics of an NMOSFET transistor and a PMOSFET transistor are studied up to 450℃. In a second step, we investigate the functionality of a ring oscillator (representing a digital circuit) and a band gap reference as an example of a simple analog component. The frequency and the current consumption of the ring oscillator, as well as the output voltage and the current of the band gap reference, are characterized up to 450℃. We find that the ring oscillator still oscillates at this high temperature with a frequency of about one third of the value at room temperature. The output voltage of the band gap reference is in the specified range (change < 3%) up to 250℃. The deviations above this temperature are analyzed and measures to improve the circuit are discussed. The acquired data provide an important foundation to extend the application of CMOS technology to its real maximum temperature limits.
机译:标准体CMOS技术的目标工作温度不超过175℃。绝缘体上硅技术通常在250℃以下使用。在这项工作中,我们评估了薄膜SOI技术在更高温度下实现的电子电路功能的极限。在Fraunhofer IMS,可以使用基于200 mm晶圆的通用1.0μmSOI-CMOS工艺。它具有三层钨金属化层,在电迁移方面具有出色的可靠性,以及与电压无关的电容器,各种电阻器和单多晶硅EEPROM。我们介绍了对在此过程中产生的MOSFET和基本电路的温度依赖性的研究。研究了NMOSFET晶体管和PMOSFET晶体管在450℃以下的电气特性。在第二步中,我们研究环形振荡器(代表数字电路)的功能和带隙基准,作为简单模拟组件的示例。环形振荡器的频率和电流消耗以及带隙基准的输出电压和电流的特征温度高达450℃。我们发现,环形振荡器在此高温下仍会以室温下的振荡频率振荡。带隙基准的输出电压在最高250℃的指定范围内(变化<3%)。分析了高于该温度的偏差,并讨论了改善电路的措施。采集的数据为将CMOS技术的应用扩展到其实际最大温度极限提供了重要基础。

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  • 作者单位

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

    Fraunhofer Institute for Microelectronic Circuits and Systems, IMS, Finkenstrasse 61, 47057 Duisburg, Germany;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Band gap reference; CMOS; high temperature; ring oscillator; silicon-on-insulator (SOI);

    机译:带隙参考;CMOS;高温;环形振荡器绝缘体上硅(SOI);

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