Design, Fabrication, and Qualification of Chip- On-Board Technology for Space electronics

摘要

The design, the development, the fabrication, and qualification of miniaturized space systems based on chip-on-board (COB) electronic packaging technology are reported in this study. The researchers have demonstrated that mass and volume reductions of a factor of 10 can be achieved. Results of several organic and inorganic protective coating combinations are presented in this paper. A combination of Parylene and epoxy coatings proved to have superior reliability in providing die protection throughout a rigorous environmental test sequence.