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机译:通过机械应力消除硅电化学蚀刻中的边界效应
Micro/Nano Science and Technology Center, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China;
Micro/Nano Science and Technology Center, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China;
Micro/Nano Science and Technology Center, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China;
Micro/Nano Science and Technology Center, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China;
Micro/Nano Science and Technology Center, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China;
Laboratory of Span-Scale Design and Manufacturing for MEMS /NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China;
Institute for Advanced Materials,School of Material Science and Engineering, Jiangsu University, Zhenjiang, 212013, China;
electrochemical etching; macroporous silicon; boundary effect; mechanical stress; current-burst-model;
机译:多重内反射几何学中红外表面吸收光谱法对硅表面电化学刻蚀过程的原位观察红外抗体对硅表面电化学刻蚀过程的原位观察
机译:在硅表面上反射地质素 - 原位硅表面蚀刻工艺中的电化学蚀刻过程的原位观察硅表面蚀刻的电化学蚀刻工艺
机译:硅电化学蚀刻中的边界效应
机译:在Fowler-nordheim的逐步湿法蚀刻期间氧化物表面粗糙度在彼得·诺德海姆的逐步湿法蚀刻型二氧化硅薄膜期间循环湿法施用氮二氧化硅膜表面粗糙度
机译:应力,吸附和蚀刻引起的硅和碳化硅表面形态的发展。
机译:电化学刻蚀制备多孔硅的形貌和纳米结构特征
机译:蚀刻时间对电化学蚀刻(ECE)制备多孔硅的理想因子和动态电阻的影响