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Characterization of evaporation and boiling from sintered powder wicks fed by capillary action

机译:毛细管作用下烧结粉芯的蒸发和沸腾特性

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The thermal resistance to heat transfer into the evaporator section of heat pipes and vapor chambers plays a dominant role in governing their overall performance. It is therefore critical to quantify this resistance for commonly used sintered copper powder wick surfaces, both under evaporation and boiling conditions. The objective of the current study is to measure the dependence of thermal resistance on the thickness and particle size of such surfaces. A novel test facility is developed which feeds the test fluid, water, to the wick by capillary action. This simulates the feeding mechanism within an actual heat pipe, referred to as wicked evaporation or boiling. Experiments with multiple samples, with thicknesses ranging from 600 to 1200 μm and particle sizes from 45 to 355 μm, demonstrate that for a given wick thickness, an optimum particle size exists which maximizes the boiling heat transfer coefficient. The tests also show that monoporous sintered wicks are able to support local heat fluxes of greater than 500 W cm~(-2) without the occurrence of dryout. Additionally, in situ visualization of the wick surfaces during evaporation and boiling allows the thermal performance to be correlated with the observed regimes. It is seen that nucleate boiling from the wick substrate leads to substantially increased performance as compared to evaporation from the liquid free surface at the top of the wick layer. The sharp reduction in overall thermal resistance upon transition to a boiling regime is primarily attributable to the conductive resistance through the saturated wick material being bypassed.
机译:热量传递到热管和蒸汽室的蒸发器部分的热阻在控制其整体性能方面起着主要作用。因此,至关重要的是在蒸发和沸腾条件下,对常用的烧结铜粉芯表面的电阻进行量化。当前研究的目的是测量热阻对此类表面的厚度和粒度的依赖性。开发了一种新颖的测试设备,该设备通过毛细作用将测试液,水输送到灯芯。这模拟了实际热管内的进料机制,称为芯吸蒸发或沸腾。对多个样品进行的实验(厚度范围从600到1200μm,粒径从45到355μm)表明,对于给定的灯芯厚度,存在最佳的粒径,该粒径可以最大化沸腾传热系数。测试还表明,单孔烧结灯芯能够支撑大于500 W cm〜(-2)的局部热通量,而不会发生变干。另外,在蒸发和沸腾过程中原位观察灯芯表面可以使热性能与观察到的状态相关。可以看出,与从灯芯层顶部的无液表面蒸发相比,从灯芯基板上形成的核沸腾导致性能大大提高。过渡到沸腾状态时,总体热阻的急剧下降主要归因于通过饱和芯吸材料的导电电阻被旁路。

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