A novel approach to temperature-dependent thermal contact conductance during transient isothermal cooling

摘要

This paper proposes a novel approach to estimate the temperature-dependent thermal contact conductance (TCC) during the isothermal cooling phase based on the induction heating. The realizability of the ideal isothermal cooling phase has been validated through the finite-element model, even for specimens with low thermal conductivity. During the cooling process, the temperature difference of the specimen can be less than 0.5%. Moreover, based on the temperature curve of isothermal cooling, nonlinear TCC can be estimated using the proposed method over a broad temperature range, e.g., 500–800 K, and the relative numerical errors will be less than 5% with virtual temperature data. Considering the real measurement condition, we introduce the Savitzky-Golay (SG) filter to reduce the noise’s effect on computation accuracy. Finally, the TCC experiments have been carried out to further verify the isothermal cooling hypothesis and the effectiveness of the method.