首页> 外文期刊>Integration >Survey on recent counterfeit IC detection techniques and future research directions
【24h】

Survey on recent counterfeit IC detection techniques and future research directions

机译:近期仿冒IC检测技术调查及未来研究方向

获取原文
获取原文并翻译 | 示例

摘要

In recent years, globalization of the semiconductor supply chain has led to a more complex production cycle with parts coming from various producers in diverse locations. Outsourcing reduces cost but leads to security vulnerabilities, and one of its forms is counterfeiting. Counterfeit ICs, if successfully embedded in an electronic device, may lead to severe consequences with potentially degraded quality, reliability and performance. Wide-spread efforts have been made both in the industry and academia to develop effective countermeasures against counterfeit ICs. In this paper, we provide a comprehensive review of recent counterfeit detection and avoidance techniques. We see that in its current state, one needs to go through a suite of techniques in order to cover testing against all the possible counterfeit types.
机译:近年来,半导体供应链的全球化导致了更复杂的生产周期,零件来自不同地点的不同生产商。外包可以降低成本,但会导致安全漏洞,其形式之一就是伪造。假冒IC如果成功嵌入到电子设备中,则可能导致严重后果,并可能导致质量,可靠性和性能下降。工业界和学术界都进行了广泛的努力,以开发出有效的对付伪造IC的对策。在本文中,我们提供了对最新的假冒检测和避免技术的全面综述。我们看到,在目前的状态下,需要通过一套技术来对所有可能的假冒类型进行测试。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号