Compact Modeling as a Bridge between Scaled Semiconductor Technologies and Advanced Designs of the Integrated Circuits

摘要

The quality of the integrated circuits analysis, required in present contemporary design flows, is directly linked to the accuracy of its basic components - the Compact Model/Simulation Program with Integrated Circuit Emphasis (SPICE) Model. The compact/SPICE modeling is an essential research activity bridging scaled semiconductor technologies and advanced designs of the integrated circuits.