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New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. New Advanced Cu Deposition Process with Long Throw Sputtering.

机译：超大型集成电路中缩小CU互连的新技术。新型先进的Cu沉积过程，长时间抛出溅射。

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Kazuo TAKAKUWA;
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年度 1998
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2. Morphology evolution in TiN/Al-0.5Cu/Ti interconnection during chamber long stay and post-deposition annealing correlated to defect formation in metallization processing [J] . Ming-Yen Li, Mei-Yun Su, Te-Fu Chang, Microelectronic Engineering . 2008,第7期

机译：TiN / Al-0.5Cu / Ti互连在腔室长时间停留和沉积后退火过程中的形态演变与金属化工艺中的缺陷形成有关
3. Highly-enhanced ref low characteristics of sputter deposited Cu interconnections of large scale integrated devices by optimizing sputtering conditions [J] . Takashi Onishi, Masao Mizuno, Tetsuya Yoshikawa, Journal of Applied Physics . 2013,第4期

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4. Review of Advanced Copper Interconnection Process -Deposition of low resistance and low stress Cu interconnection layer - [C] . Tohru Hara Nineteenth International VLSI Multilevel Interconnection Conference (VMIC) Nov 19-20, 2002 Singapore . 2002

机译：先进的铜互连工艺的回顾-低电阻低应力铜互连层的沉积-
5. Chemical vapor deposition of amorphous tungsten nitride for applications in ultra-large scale interconnect technologies. [D] . Kelsey, Jean E. 1999

机译：用于超大规模互连技术的非晶态氮化钨的化学气相沉积。
6. Material design of plasma-enhanced chemical vapour deposition SiCH films for low-k cap layers in the further scaling of ultra-large-scale integrated devices-Cu interconnects [O] . Hideharu Shimizu, Shuji Nagano, Akira Uedono, 2013

机译：用于进一步缩小超大型集成器件-Cu互连的等离子增强化学气相沉积SiCH膜的低k覆盖层的材料设计
7. New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. Status and Issues of Copper Film Deposition Technologies for Scaled-down Cu Interconnection. [O] . Kazuyoshi UENO 1998

机译：超大型集成电路中缩小CU互连的新技术。缩小CU互连铜膜沉积技术的现状与问题。
8. Metastable pitting corrosion of aluminum, Al-Cu, and Al-Si thin films in dilute HF solutions and its relevancy to the processing of integrated circuit interconnections. [R] . J. R. Scully D. E. Peebles 1991

机译：在稀HF溶液中铝，al-Cu和al-si薄膜的亚稳态点腐蚀及其与集成电路互连处理的相关性。

New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. New Advanced Cu Deposition Process with Long Throw Sputtering.

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