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Maximizing Stuck-open Fault Coverage Using Stuck-at Test Vectors

机译:使用卡滞测试向量最大化卡滞故障覆盖率

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摘要

Physical defects that are not covered by stuck-at fault or bridging fault model are increasing in LSI circuits designed and manufactured in modern Deep Sub-Micron (DSM) technologies. Therefore, it is necessary to target non-stuck-at and non-bridging faults. A stuck-open is one such fault model that captures transistor level defects. This paper presents two methods for maximizing stuck-open fault coverage using stuck-at test vectors. In this paper we assume that a test set to detect stuck-at faults is given and we consider two formulations for maximizing stuck-open coverage using the given test set as follows. The first problem is to form a test sequence by using each test vector multiple times, if needed, as long as the stuck-open coverage is increased. In this case the target is to make the resultant test sequence as short as possible under the constraint that the maximum stuck-open coverage is achieved using the given test set. The second problem is to form a test sequence by using each test vector exactly once only. Thus in this case the length of the test sequence is maintained as the number of given test vectors. In both formulations the stuck-at fault coverage does not change. The effectiveness of the proposed methods is established by experimental results for benchmark circuits.
机译:在采用现代深亚微米(DSM)技术设计和制造的LSI电路中,无法由卡住的故障或桥接故障模型覆盖的物理缺陷正在增加。因此,有必要针对非卡滞和非桥接故障。断路是一种捕获晶体管级缺陷的故障模型。本文提出了两种使用卡死测试向量最大化卡死故障覆盖率的方法。在本文中,我们假设给出了一个用于检测卡住故障的测试集,并且我们考虑了两种使用给定测试集最大化卡塞开放覆盖率的公式,如下所示。第一个问题是,如果需要,只要增加打开区域的覆盖率,就可以通过多次使用每个测试向量来形成测试序列。在这种情况下,目标是在使用给定测试集实现最大卡塞覆盖范围的约束下,使最终的测试序列尽可能短。第二个问题是通过仅使用每个测试向量仅形成一次来形成测试序列。因此,在这种情况下,测试序列的长度保持为给定测试向量的数量。在两种公式中,卡住的故障覆盖率都不会改变。所提方法的有效性通过基准电路的实验结果确定。

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