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Gate Tunnelling and Impact Ionisation in Sub 100 nm PHEMTs

机译:100 nm以下PHEMT中的栅极隧穿和碰撞电离

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摘要

Impact ionization and thermionic tunnelling as two possible breakdown mechanisms in scaled pseudomorphic high electron mobility transistors (PHEMTs) are investigated by Monte Carlo (MC) device simulations. Impact ionization is included in MC simulation as an additional scattering mechanism whereas thermionic tunnelling is treated in the WKB approximation during each time step in self-consistent MC simulation. Thermionic tunnelling starts at very low drain voltages but then quickly saturates. Therefore, it should not drastically affect the performance of scaled devices. Impact ionization threshold occurs at greater drain voltages which should assure a reasonable operation voltage scale for all scaled PHEMTs.
机译:通过蒙特卡罗(MC)器件仿真研究了碰撞电离和热电子隧穿作为比例缩放的拟晶型高电子迁移率晶体管(PHEMT)中两种可能的击穿机制。碰撞电离作为附加的散射机制包含在MC模拟中,而自洽MC模拟中的每个时间步长都以WKB近似处理热电子隧穿。热电子隧穿始于非常低的漏极电压,但随后很快饱和。因此,它不应严重影响缩放设备的性能。碰撞电离阈值出现在较高的漏极电压下,这应确保所有缩放后的PHEMT都具有合理的工作电压范围。

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