X線透視による新しい故障解析技術の研究

摘要

電子デバイスの微細化・高密度化に伴い、故障箇所の検出は益々難しさを増してきている。このためマイクロフォーカスX線透視装置、超音波探傷装置などによる非破壊状態での解析が、故障解析を進める上で極めて重要な役割を担ってくる。筆者は、かねてから故障解析機器としてX線透視装置を用いた非破壊解析の有効性に着目し、その応用研究に取り組んできた。特に最近における高分解能化、画像処理の高速化など装置の性能は飛躍的に進歩してきている。従来観察が困難とされてきた分野にも応用範囲が広められる可能性が高まってきた。現在研究を進めているポイドや電子部品内部欠陥部の3D解析、発火箇所の原因究明、高速度カメラを利用した製品内部における破壊プロセス解析など、最近の活用事例について紹介する。%Along with small size and high density evolution in electronic equipments, difficulty to detect flaw has been increasing more and more. This is the reason why analysis by Microfocus X-ray CT System, Scanning Acoustic Tomograph, etc. has become taking quite important role in failure analysis. Author has focused attention on effectiveness of non-destructive analysis by X-ray CT System as failure analysis equipment, and has worked on the applied research.rnRecently such equipments performance has significantly progressed in high resolution, high speed image processing, etc.rnThe range of application possibility of these equipments to the field where observation was assumed to be difficult up to now has risen.rnIn this paper, author introduces latest application examples which author is studying now, such as 3D analysis of internal void or flaw in electronic components, root cause analysis of firing, and high speed camera analysis of internal breaking process of the products.