Recently, the operation speed-up of IC is advanced along with the development of the information society. The highspeed switching operation of IC causes the power source noise, and becomes a problembecause it originates in it and it is generated. The examination of the sub-strate edge resistance addition method is advanced in this laboratory so that the radiated emission may decrease. Up to now, the effectiveness ofthe resistance addition method in a top and bottomofthe square etc. and symmetric substrate has been confirmed. Because the effect ofthe decrease is examined by the resistance type and the addition position when the fineness ratio of a rectangular substrate is changed, and the result came out to some degree, it reports in the present study.%近年，情報化社会の進展に伴い，ICの動作高速化が進んでいる。ICの高速スイッチング動作は電源雑音を生じさせ，それに起因して放射発生するため問題となっている。本研究室では放射雑音低減を目的に基板端抵抗付加法の検討を進めている。これまで，正方形等の上下左右対称基板における抵抗付加法の有効性を確認されている。本研究では長方形基板における抵抗付加法の検討を行っている．今回，基板の縦横比の変化および抵抗付加位置による放射雑音の影響評価について報告を行う。
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