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A photoacoustic imager with light illumination through an infrared-transparent silicon CMUT array

机译:通过红外透明硅CMUT阵列进行光照明的光声成像仪

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摘要

A novel hardware design and preliminary experimental results for photoacoustic imaging are reported in this paper. This imaging system makes use of an infrared-transparent capacitive micromachined ultrasonic transducer (CMUT) chip for ultrasound reception and illuminates the image target through the CMUT array. The cascaded arrangement between the light source and transducer array allows for a more compact imager head and results in more uniform illumination. Taking advantage of the low optical absorption coefficient of silicon in the near infrared spectrum as well as the broad acoustic bandwidth that CMUTs provide, an infrared-transparent CMUT array has been developed for ultrasound reception. The center frequency of the polysilicon-membrane CMUT devices used in this photoacoustic system is 3.5 MHz, with a fractional bandwidth of 118% in reception mode. The silicon substrate of the CMUT array has been thinned to 100 -m and an antireflection dielectric layer is coated on the back side to improve the infrared-transmission rate. Initial results show that the transmission rate of a 1.06-μm Nd:Yag laser through this CMUT chip is 12%. This transmission rate can be improved if the thickness of silicon substrate and the thin-film dielectrics in the CMUT structure are properly tailored. Imaging of a metal wire phantom using this cascaded photoacoustic imager is demonstrated.
机译:本文报道了一种新颖的硬件设计和光声成像的初步实验结果。该成像系统利用红外透明电容微机械超声换能器(CMUT)芯片进行超声接收,并通过CMUT阵列照亮图像目标。光源和换能器阵列之间的级联排列可实现更紧凑的成像头,并产生更均匀的照明。利用近红外光谱中硅的低光吸收系数以及CMUT提供的宽声带宽,已开发出红外透明CMUT阵列用于超声接收。在该光声系统中使用的多晶硅膜CMUT器件的中心频率为3.5 MHz,在接收模式下的分数带宽为118%。 CMUT阵列的硅基板已减薄至100-m,并在背面涂覆了抗反射电介质层以提高红外透射率。初步结果表明,1.06-μmNd:Yag激光通过此CMUT芯片的传输率为12%。如果适当地调整CMUT结构中的硅基板厚度和薄膜电介质,则可以提高该传输速率。演示了使用这种级联的光声成像仪对金属线体模成像。

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