It is pointed out that the demands for precision and speed in manufacturing processes in the semiconductor industry are not well suited to traditional, large-scale approaches to automation. Consideration of several microautomation approaches has led to the development of a magnetic levitation-based system capable of three-dimensional motions. Such systems are able to move quickly and precisely, and can deliver prescribed forces and moments. Several significant applications of magnetic levitation-based microautomation in semiconductor manufacturing have been identified. These include positioning operations at various scales, such as mask alignment, hybrid circuit assembly, and transport between process stations. Other applications are analytical probing, nondestructive tape automated bonding (TAB) bond testing, and optical system alignment. A prototype system capable of high-speed four-degree-of-freedom motions with 0.5- mu m accuracy over small workspaces has been demonstrated.
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