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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Comments, with reply, on 'Dose perturbation by wafer charging during ion implantation' by Y. Sato et al
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Comments, with reply, on 'Dose perturbation by wafer charging during ion implantation' by Y. Sato et al

机译:Y. Sato等人对“离子注入过程中晶片充电引起的剂量扰动”发表评论并作出答复

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摘要

The commenter remarks on a statement in the above-titled work by Y. Sato et al., (ibid., vol.5, no.4, pp.329-336, Nov. 1992) concerning a study that the commenter co-authored (M.E. Mack et al., 1985). The statement is that the latter work suggests that beam blowup resulting from wafer charging does not disturb dose control of adjacent wafers in the vicinity of the charging wafer, unlike their own observations. The commenter clarifies this work and argues that the gross dose errors reported by Y. Sato et al. are caused by blowup of the beam through loss of space-charge neutralization over at least 1-m distance. He points out that the use of the flood gun with biased aperture ameliorates the problem. The original authors respond by defending their results.
机译:评论者评论了Y. Sato等人在上述著作中的发言(同上,第5卷,第4期,第329-336页,1992年11月)。作者(ME Mack等,1985)。陈述是,后者的工作表明,由于晶片充电而引起的光束爆炸不会干扰充电晶片附近的相邻晶片的剂量控制,这与它们自己的观察结果不同。评论者澄清了这项工作,并认为Y. Sato等人报告的总剂量错误。这是由于至少1 m距离内空间电荷中和的损失导致光束爆炸而引起的。他指出,带偏光圈的溢流枪的使用可改善此问题。原始作者通过捍卫自己的结果做出回应。

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