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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Robust Relevance Vector Machine With Variational Inference for Improving Virtual Metrology Accuracy
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Robust Relevance Vector Machine With Variational Inference for Improving Virtual Metrology Accuracy

机译:具有变分推理的鲁棒相关矢量机,提高虚拟计量精度

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摘要

Virtual metrology (VM) technology is an efficient and effective method of online and wafer-to-wafer process monitoring. It is realized by constructing a prediction model between real-time equipment sensor data and the quality characteristics of wafers that should be measured. The most commonly employed prediction method for VM is a neural network (NN) approach due to its flexibility and fast computation time. However, it can easily suffer from the overfitting problem and is affected by naturally occurring potential outlying observations contained in given data. Moreover, it does not provide prediction intervals for future observations that can be used to detect abnormal process problems. In this paper, an advanced prediction model for VM is developed to resolve these issues. The proposed method is a robust regression model based on relevance vector machine. The proposed method can reduce the effect of outliers by using a weight strategy. Given a prior distribution of weights, it is shown that the weight values can be determined in a probabilistic way and computed automatically during training. We employ the variational inference method to estimate the posterior distribution over model parameters. Therefore, no validation data set is needed to control the model complexity. That is, the complexity of our proposed method can be self-adjusted in the model training phase. Based on the posterior distribution, we can obtain not only point estimates but useful statistical information such as probabilistic intervals which provide us some useful information about the current status of a manufacturing process. If the actual metrology value falls outside of the intervals, it can be a signal which alerts engineers to the need for preventive maintenance or VM model adjustment. The real plasma etching process of semiconductor manufacturing is presented as a case study to compare the predictive performance of our proposed method with that of conventional VM prediction models. The - xperimental results demonstrate that the proposed method can improve VM prediction accuracy compared to other methods.
机译:虚拟度量(VM)技术是一种在线监测和晶圆间工艺监控的有效方法。它是通过在实时设备传感器数据和应测量晶片的质量特性之间构建预测模型来实现的。 VM的最常用预测方法是神经网络(NN)方法,因为它具有灵活性和快速的计算时间。但是,它很容易遭受过度拟合的问题,并受到给定数据中包含的自然发生的潜在异常观测值的影响。而且,它没有为可用于检测异常过程问题的未来观察提供预测间隔。在本文中,开发了一种用于VM的高级预测模型来解决这些问题。该方法是基于相关向量机的鲁棒回归模型。所提出的方法可以通过使用权重策略来减少离群值的影响。给定权重的先验分布,表明可以在训练过程中以概率方式确定和自动计算权重值。我们采用变分推断方法来估计模型参数的后验分布。因此,不需要验证数据集即可控制模型的复杂性。也就是说,我们提出的方法的复杂性可以在模型训练阶段进行自我调整。基于后验分布,我们不仅可以获取点估计值,还可以获取有用的统计信息(例如概率间隔),这些信息为我们提供了有关制造过程当前状态的一些有用信息。如果实际度量值不在间隔范围内,则可能是一个信号,警告工程师需要预防性维护或VM模型调整。提出了半导体制造的实际等离子刻蚀工艺作为案例研究,以比较我们提出的方法与常规VM预测模型的预测性能。实验结果表明,与其他方法相比,该方法可以提高VM预测的准确性。

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