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首页> 外文期刊>Semiconductor Manufacturing, IEEE Transactions on >How Target Physical Properties Affect Thin-Body Semiconductor Doping When Using Energetic Ions: A Modeling-Based Analysis
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How Target Physical Properties Affect Thin-Body Semiconductor Doping When Using Energetic Ions: A Modeling-Based Analysis

机译:当使用高能离子时,目标物理特性如何影响薄体半导体掺杂:基于模型的分析

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In this paper, the authors investigate how target sputtering, dose retention, and damage formation is generated in thin-body semiconductors by means of energetic ion impacts. The problems associated with ion implanting or plasma doping Si thin-bodies are well documented, however, it is not clear how changing the target material to other semiconductors currently being considering for multi-gate field-effect transistor devices will counteract or enhance these effects. By means of binary collision approximation based modeling with the Stopping and Range of Ions in Matter (SRIM) software, we explore the consequences of different target atomic density, lattice density, surface binding energies, and lattice binding energies on target sputtering, dose retention, and damage formation.
机译:在本文中,作者研究了如何通过高能离子冲击在薄体半导体中产生靶溅射,剂量保持和损伤形成。与离子注入或等离子掺杂Si薄体相关的问题已得到充分证明,但是,目前尚不清楚将目标材料更改为当前正在考虑用于多栅极场效应晶体管器件的其他半导体将如何抵消或增强这些效果。通过使用物质中离子的终止和范围(SRIM)软件进行基于二进制碰撞近似的建模,我们探索了不同靶原子密度,晶格密度,表面结合能和晶格结合能对靶溅射,剂量保留,和损害形成。

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