Reliability assessment of fielded plastic and hermetically packaged microelectronics

摘要

This paper presents the results from multiple studies at Honeywell, of piece-part failure rates experienced in field use. These studies consider 7 line-replaceable-units (LRU), containing either hermetically sealed microcircuits (HSM) or plastic encapsulated microcircuits (PEM) or both. This paper compares the resulting field failure rates (/spl lambda/) of HSM and PEM: digital devices: /spl lambda//sub PEM//spl ap/0.5/spl lambda//sub HSM/; linear devices: /spl lambda//sub PEM//spl ap/3/spl lambda//sub HSM/; only a small fraction of the linear devices degraded in performance at 125/spl deg/C, though their performance at room temperature was within specification. The latter two points suggest that linear devices might require more attention relative to characterization over temperature and application considerations than do digital devices.