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首页> 外文期刊>IEEE Transactions on Reliability >Reliability life-testing and failure-analysis of GaAs monolithicKu-band driver amplifiers
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Reliability life-testing and failure-analysis of GaAs monolithicKu-band driver amplifiers

机译:GaAs单片Ku波段驱动器放大器的可靠性寿命测试和故障分析

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`Gallium-arsenide monolithic microwave integrated-circuit (MMIC)nKu-band driver amplifiers were life tested under accelerated highntemperature, DC and RF conditions until failure. These MMIC are used innvarious applications such as radar and satellite communication systems.nThe failure mechanisms controlling their reliability must be understoodnin order to improve the lifetime for these and other applications. Thisnpaper discusses the experimental procedures, statistical evaluation ofnthe data and failure analysis of the devices. To the authors' knowledge,nthis is the first report of RF life testing of dual-gate drivernamplifiers. The majority of the devices failed catastrophically due tonhigh drain current, while others failed parametrically due to low outputnpower. Failure analysis indicates that degradation of thenSi3N4 dielectric layer to be the main failurenmechanism in these MMIC. Statistical analysis revealed an activationnenergy of 0.87 eV and a median lifetime of 5.8·104nhours at 140°C channel temperature, which is consistent withnsurface-phenomena failure mechanisms
机译:砷化镓单片微波集成电路(MMIC)nKu带驱动器放大器在加速的高温,DC和RF条件下进行了寿命测试,直到出现故障。这些MMIC用于各种应用,例如雷达和卫星通信系统。n必须理解控制其可靠性的故障机制,以延长这些和其他应用的寿命。本文讨论了实验程序,数据统计评估和设备故障分析。据作者所知,这是双栅极驱动器放大器RF寿命测试的第一份报告。大多数器件由于漏极电流过大而导致灾难性故障,而其他器件则因输出功率低而参数性故障。失效分析表明,Si 3 N 4介电层的退化是这些MMIC中的主要失效机理。统计分析表明,在140°C的通道温度下,活化能为0.87 eV,平均寿命为5.8·104nhours,这与表面现象的破坏机理相符。

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