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Simulation of the Sputtered Atom Transport During a Pulse Deposition Process in Single- and Dual-Magnetron Systems

机译:单磁控和双磁控系统中脉冲沉积过程中溅射原子传输的模拟

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Results are presented for Monte Carlo simulation of the sputtered atom transport in systems with one and two magnetrons operating in pulse mode. The magnetron system geometry as well as gas pressure and the gap between the targets and substrate strongly influence the features of the forward and backward sputtered atom flows, time behavior, and energy of depositing atoms. The shape of current pulses affects the modulation level of the atom flows that is higher in the case of triangular pulses. The magnetron systems, with inclined targets and a V-shaped target, feature the higher efficiency of atom transport (as compared with the dual coplanar target system or an ordinary one with the flat target) due to the decrease of the atom loss on the chamber walls and shortening the path of the sputtered atoms to the substrate.
机译:给出了在具有一个和两个磁控管以脉冲模式运行的系统中溅射原子传输的蒙特卡洛模拟结果。磁控管系统的几何形状以及气压和靶材与基板之间的间隙会强烈影响正向和反向溅射原子流,时间行为以及沉积原子的能量。电流脉冲的形状影响原子流的调制水平,在三角脉冲的情况下,调制水平更高。具有倾斜靶和V形靶的磁控管系统具有原子传输效率更高的特点(与双共面靶系统或带有平坦靶的普通系统相比),这是因为减少了腔室上的原子损失壁和缩短溅射原子到基板的路径。

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