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首页> 外文期刊>IEEE Transactions on Nuclear Science >Resolution Limits in 130 nm and 90 nm CMOS Technologies for Analog Front-End Applications
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Resolution Limits in 130 nm and 90 nm CMOS Technologies for Analog Front-End Applications

机译:用于模拟前端应用的130 nm和90 nm CMOS技术中的分辨率极限

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摘要

In the last few years CMOS commercial technologies of the quarter micron node have been extensively used in the design of the readout electronics for highly granular detection systems in the particle physics environment. IC designers are now moving to 130 nm CMOS technologies, or even to the next technology generation, to implement readout integrated circuits for future HEP applications. In order to evaluate how scaling down of the device features affects their performances, continuous technology monitoring is mandatory. In this work the results of signal and noise measurements carried out on two CMOS commercial processes are presented. Data obtained from the measurements provide a powerful tool to establish design criteria in nanoscale CMOS processes for detector front-ends and can be used to evaluate the resolution limits achievable for low-noise charge sensitive amplifiers in the 100-nm minimum feature size range.
机译:在最近几年中,四分之一微米节点的CMOS商业技术已广泛用于粒子物理环境中的高度颗粒检测系统的读出电子设备的设计中。 IC设计人员现在正朝着130 nm CMOS技术乃至下一代技术转移,以为未来的HEP应用实现读出集成电路。为了评估缩小的设备功能如何影响其性能,必须进行连续的技术监视。在这项工作中,介绍了在两个CMOS商业过程中执行的信号和噪声测量的结果。从测量中获得的数据为建立用于探测器前端的纳米级CMOS工艺中的设计标准提供了强大的工具,并可用于评估最小特征尺寸范围为100 nm的低噪声电荷敏感放大器可达到的分辨率极限。

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