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Modeling Single Event Crosstalk in Nanometer Technologies

机译:在纳米技术中建模单事件串扰

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With advances in CMOS technology, circuits become increasingly more sensitive to transient pulses caused by single event (SE) particles. On the other hand, coupling effects among interconnects can cause SE transients to contaminate electronically unrelated circuit paths which may increase the SE susceptibility of CMOS circuits. The coupling effects among interconnects need to be considered in single event hardening, modeling and analysis of CMOS logic gates due to technology scaling effects that increase both SE vulnerability and crosstalk effects. This work, for the first time, proposes an SE crosstalk noise estimation method for use in design automation tools. The proposed method uses an accurate 4-$pi$ model for interconnect and correctly models the effect of non-switching aggressors as well as aggressor tree branches noting the resistive shielding effect. The SE crosstalk noise expressions derived show very good results in comparison to HSPICE results. Results show that average error for noise peak is about 6.2% while allowing for very fast analysis in comparison to HSPICE.
机译:随着CMOS技术的进步,电路对由单事件(SE)粒子引起的瞬态脉冲越来越敏感。另一方面,互连之间的耦合效应会导致SE瞬态污染电子无关的电路路径,从而增加CMOS电路的SE敏感性。由于技术缩放效应会同时增加SE漏洞和串扰效应,因此在CMOS逻辑门的单事件强化,建模和分析中需要考虑互连之间的耦合效应。这项工作首次提出了一种SE串扰噪声估计方法,用于设计自动化工具。所提出的方法使用精确的4- $ pi $ 模型进行互连,并正确地模拟了非切换攻击者的影响因为侵略性树枝注意到电阻屏蔽效果。与HSPICE结果相比,得出的SE串扰噪声表达式显示出非常好的结果。结果表明,与HSPICE相比,噪声峰值的平均误差约为6.2%,同时允许非常快速的分析。

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