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An Investigation of the SET Response of Devices and Differential Pairs in a 32-nm SOI CMOS Technology

机译:32nm SOI CMOS技术中器件和差分对的SET响应的研究

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摘要

The single event effect (SEE) response of devices and differential pairs in a 32-nm SOI CMOS technology is explored using laser-induced carrier injection and TCAD simulations. Both nFETs and pFETs in this technology exhibit similar sensitive area to laser-induced SEE and are strongly dependent on the drain bias condition. TCAD simulations were conducted in order to confirm results and utilize a 3-D mixed-mode simulation approach to more accurately model testing conditions. The differential pair (diff. pair) circuit SEE response extends the discussion to include the use of these devices in a core analog/RF circuit block. The analysis includes the use of floating body (FB) and body-connected (BC) devices. Body-connected FETs tend to exhibit a transient response that is much shorter in duration when compared directly to its floating body counterpart.
机译:使用激光诱导的载流子注入和TCAD仿真,探索了32nm SOI CMOS技术中器件和差分对的单事件效应(SEE)响应。该技术中的nFET和pFET都具有与激光诱导的SEE相似的敏感区域,并且强烈依赖于漏极偏置条件。进行TCAD仿真以确认结果并利用3-D混合模式仿真方法更准确地对测试条件进行建模。差分对(diff.pair)电路SEE响应扩展了讨论范围,将这些设备包括在核心模拟/ RF电路模块中使用。分析包括浮体(FB)和体连接(BC)设备的使用。与直接连接的浮动FET相比,连接FET的瞬态响应的持续时间要短得多。

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