Al-SiO/sub 2/-Al sandwich microstrip lines for high-frequency on-chip interconnects

摘要

A downscaled 2- mu m-wide microstrip line fabricated with both signal and ground conductors on top of the substrate is presented. A significantly reduced geometric dispersion for a roughly 400-GHz bandwidth pulse was measured on this waveguide, using the time-resolved electrooptic sampling technique. The mode of the electromagnetic signal is strongly confined, promising reduced crosstalk between densely packed interconnects.