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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >Modeling and characterization of SiGe HBT low-frequency noise figures-of-merit for RFIC applications
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Modeling and characterization of SiGe HBT low-frequency noise figures-of-merit for RFIC applications

机译:用于RFIC应用的SiGe HBT低频噪声品质因数的建模和表征

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We present the first systematic experimental and modeling results of noise corner frequency (f/sub C/) and noise corner frequency to cutoff frequency ratio (f/sub C//f/sub T/) for SiGe heterojunction bipolar transistors (HBTs) in a commercial SiGe RF technology. The f/sub C/ and f/sub C//f/sub T/ ratio are investigated as a function of operating collector current density, SiGe profile, breakdown voltage, and transistor geometry. We demonstrate that both the f/sub C/ and f/sub C//f/sub T/ ratio can be significantly reduced by careful SiGe profile optimization. A comparison of the f/sub C/ and f/sub C//f/sub T/ ratio for high breakdown and standard breakdown voltage devices is made. Geometrical scaling data show that the SiGe HBT with A/sub E/=0.5/spl times/2.5 /spl mu/m/sup 2/ has the lowest f/sub C/ and f/sub C//f/sub T/ ratio compared to other device geometries. An f/sub C/ reduction of nearly 50% can be achieved by choosing this device as the unit cell in RF integrated-circuit design.
机译:我们提出了SiGe异质结双极晶体管(HBT)的噪声转折频率(f / sub C /)和噪声转折频率与截止频率之比(f / sub C // f / sub T /)的第一个系统实验和建模结果。商业SiGe RF技术。 f / sub C /和f / sub C // f / sub T /比率是作为工作集电极电流密度,SiGe分布,击穿电压和晶体管几何形状的函数进行研究的。我们证明,通过谨慎的SiGe轮廓优化,可以显着降低f / sub C /和f / sub C // f / sub T /比率。比较了高击穿电压和标准击穿电压器件的f / sub C /和f / sub C // f / sub T /比率。几何比例缩放数据显示,具有A / sub E / = 0.5 / spl次/2.5 / spl mu / m / sup 2 /的SiGe HBT具有最低的f / sub C /和f / sub C // f / sub T /与其他设备几何形状的比率。通过选择该器件作为RF集成电路设计中的单位单元,可以将f / sub C /降低近50%。

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