首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >Novel High-$Q$ MEMS Curled-Plate Variable Capacitors Fabricated in 0.35-$mu{hbox {m}}$ CMOS Technology
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Novel High-$Q$ MEMS Curled-Plate Variable Capacitors Fabricated in 0.35-$mu{hbox {m}}$ CMOS Technology

机译:采用0.35- $ mu {hbox {m}} $ CMOS技术制造的新型高价Q $ MEMS卷曲板可变电容器

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摘要

Two microelectromechanical systems (MEMS) curled-plate variable capacitors, built in 0.35-mum CMOS technology, are presented. The plates of the presented capacitors are intentionally curled upward to control the tuning performance. A newly developed maskless post-processing technique that is appropriate for MEMS/CMOS circuits is also presented. This technique consists of dry-and wet-etching steps and is developed to implement the proposed MEMS variable capacitors in CMOS technology. The capacitors are simulated mechanically by using the finite-element method in ANSYS, and the results are compared with the measured results. Two novel structures are presented. The first capacitor is a tri-state structure that exhibits a measured tuning range of 460% at 1 GHz with a flat capacitance response that is superior to that of conventional digital capacitors. The proposed capacitor is simulated in Ansoft''s high frequency structure simulator (HFSS) and the capacitance extracted is compared with the measured capacitance over a frequency range of 1-5 GHz. The second capacitor is an analog continuous structure that demonstrates a measured continuous tuning range of 115% at 1 GHz with no pull-in. The measured quality factor is better than 300 at 1.5 GHz. The proposed curled-plate capacitors have a small area and can be realized to build a system-on-chip.
机译:介绍了两个采用0.35微米CMOS技术构建的微机电系统(MEMS)卷曲板可变电容器。所提供电容器的极板有意向上卷曲以控制调谐性能。还介绍了适用于MEMS / CMOS电路的新开发的无掩模后处理技术。该技术包括干法蚀刻和湿法蚀刻步骤,被开发用于在CMOS技术中实现建议的MEMS可变电容器。使用ANSYS中的有限元方法对电容器进行机械模拟,并将结果与​​测量结果进行比较。提出了两种新颖的结构。第一电容器是三态结构,在1 GHz时测得的调谐范围为460%,平坦电容响应优于常规数字电容器。拟议的电容器在Ansoft的高频结构仿真器(HFSS)中进行了仿真,并将提取的电容与1-5 GHz频率范围内测得的电容进行比较。第二个电容器是一个模拟连续结构,在1 GHz时没有引入,它的实测连续调谐范围为115%。在1.5 GHz下,测得的品质因数优于300。所提出的卷曲板电容器具有较小的面积,并且可以实现以构建片上系统。

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