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Characterization and Modeling of RF GaN Switches Accounting for Trap-Induced Degradation Under Operating Regimes

机译:考虑工作条件下陷阱引起的降解的RF GaN开关的表征和建模

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This paper describes the performance degradation of RF GaN-on-SiC HEMT switches due to the charge trapping, which is triggered by high voltages under operating regimes. A custom measurement setup is used for the characterization of the switching behavior under dynamic control and blocking voltages. It is shown that both small- [i.e., insertion loss (IL)] and large-signal (LS) performances (i.e., switch compression) are affected by traps. Depending on the applied voltages, an increase of the switch IL up to 50% and significant degradation of the switch compression characteristic were measured for a$4 imes 75,,mu ext{m}^{2}$RF switch in 0.25-$mu ext{m}$GaN-on-SiC technology. These mechanisms cannot be observed with conventional static characterization, and they are not described by standard RF switch models. A device model capable to account for the observed characteristics is identified and empirically validated under LS conditions at 10 GHz.
机译:本文介绍了由于电荷陷阱引起的RF GaN-on-SiC HEMT开关的性能下降,电荷陷阱是由工作状态下的高电压触发的。使用定制的测量设置来表征动态控制和阻断电压下的开关行为。结果表明,小陷阱(即插入损耗(IL))和大信号(LS)性能(即开关压缩)都受到陷阱的影响。取决于所施加的电压,对于a n <inline-line xmlns:mml =“ http://www.w3”,测量了开关IL的增加高达50%,并且开关压缩特性显着降低。 org / 1998 / Math / MathML “ xmlns:xlink = ” http://www.w3.org/1999/xlink “> $ 4 乘以75 ,, mu text {m} ^ {2} $ nRF切换为0.25- n $ mu text {m} $ nGaN-on-SiC技术。这些机制无法通过常规的静态特性观察到,并且标准RF开关模型也未对其进行描述。在10 GHz的LS条件下,识别并能够验证观察到的特性的设备模型并通过经验验证。

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