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MR characteristics of Ni/sub 81/Fe/sub 19//Cu multilayers deposited by Kr sputtering with Ar ion bombardment on interfaces

机译:Kr溅射结合Ar离子轰击沉积Ni / sub 81 / Fe / sub 19 // Cu多层膜的MR特性

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摘要

Ni/sub 81/Fe/sub 19//Cu multilayers with giant magnetoresistive effect were deposited by the dual ion beam sputtering method. Only two monolayers at the interfaces in Ni/sub 81/Fe/sub 19//Cu multilayers deposited by Ar and/or Kr sputtering were exposed to Ar ion bombardment to change the interfacial conditions, such as sharp interface, local mixing and interfacial diffusion. The effect of ion bombardment to interfaces at restricted acceleration voltage of 160 V for the films by Ar sputtering and 140 V for the films by Kr sputtering and reduction of residual stress seems to be useful for obtaining preferable GMR characteristics, where clear interfaces and the best crystallinity seems to be attained in the multilayers.
机译:通过双离子束溅射法沉积具有巨磁阻效应的Ni / sub 81 / Fe / sub 19 // Cu多层膜。通过Ar和/或Kr溅射沉积的Ni / sub 81 / Fe / sub 19 // Cu多层膜中的界面上只有两个单层暴露于Ar离子轰击以改变界面条件,例如尖锐的界面,局部混合和界面扩散。对于通过Ar溅射形成的受限加速电压,通过Ar溅射形成的薄膜加速电压为160 V,通过Kr溅射形成的薄膜加速限制为140 V的离子轰击界面以及减小残余应力的作用,似乎对于获得较佳的GMR特性(其中界面清晰,最佳似乎在多层中达到结晶度。

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