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首页> 外文期刊>IEEE transactions on device and materials reliability >Investigation of High-Voltage MOSFET Reliability in $I_{rm KIRK}$ Region
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Investigation of High-Voltage MOSFET Reliability in $I_{rm KIRK}$ Region

机译:$ I_ {rm KIRK} $地区的高压MOSFET可靠性研究

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This paper evaluates the hot-carrier performance of the n-channel high-voltage (30 V) MOSFET device. This device is widely used in high-voltage linear products. It can withstand 30 V across any two terminals. This large voltage range requires thorough hot-carrier analysis, investigating potential hot-carrier mechanisms not believed to have been previously explored in the literature. It is established that two different hot-carrier generation mechanisms are occurring: one at $I_{{rm SUB}(max)}$ and another at $I_{rm KIRK}$. These are investigated through combined device parametric, technology computer-aided design (TCAD) simulation, and hot-carrier reliability data.
机译:本文评估了n沟道高压(30 V)MOSFET器件的热载流子性能。该器件广泛用于高压线性产品。它可以承受任意两个端子的30 V电压。如此大的电压范围需要进行彻底的热载流子分析,以研究潜在的热载流子机制,而文献中尚未对此进行过探索。可以确定发生了两种不同的热载流子产生机制:一种在$ I _ {{rm SUB}(max)} $,另一种在$ I_ {rm KIRK} $。通过组合的设备参数,技术计算机辅助设计(TCAD)仿真和热载流子可靠性数据来研究这些问题。

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