...
首页> 外文期刊>Device and Materials Reliability, IEEE Transactions on >Neutron-Induced Charge Collection Simulation of Bulk FinFET SRAMs Compared With Conventional Planar SRAMs
【24h】

Neutron-Induced Charge Collection Simulation of Bulk FinFET SRAMs Compared With Conventional Planar SRAMs

机译:与传统的平面SRAM比较的中子诱导Fin SRAM电荷收集模拟

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The relative neutron-induced soft-error rate (SER) of bulk FinFET SRAMs compared to planar SRAMs is estimated based on drain area, collected charge, and critical charge using mixed-mode 3-D TCAD simulations. The critical charges of the bulk FinFET and planar devices are comparable, with identical gate length, gate width, and gate oxide thickness. However, the charges collected by the bulk FinFET drain due to ion strikes are smaller than those by the planar FET drain. Bulk FinFETs are anticipated to exhibit lower SER sensitivity compared to planar FETs.
机译:使用混合模式3-D TCAD仿真,基于漏极面积,收集的电荷和临界电荷,可以估算大容量FinFET SRAM与平面SRAM相比的中子感应软错误率(SER)。批量FinFET和平面器件的临界电荷相当,栅极长度,栅极宽度和栅极氧化物厚度相同。但是,由于FinFET漏极由于离子撞击而收集的电荷小于平面FET漏极所收集的电荷。预计与平面FET相比,体FinFET表现出较低的SER灵敏度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号