...
首页> 外文期刊>IEEE transactions on device and materials reliability >Mode Mixity Dependence of Interfacial Fracture Toughness in Organic Electronic Structures
【24h】

Mode Mixity Dependence of Interfacial Fracture Toughness in Organic Electronic Structures

机译:电子结构中界面断裂韧性的模式混合度依赖性

获取原文
获取原文并翻译 | 示例
           

摘要

This paper presents the results of a combined experimental and theoretical study of interfacial fracture in organic electronic structures. Interfacial fracture toughness is investigated as a function of mode mixity using Brazil disk specimens. The measured fracture toughness values are then compared with predictions determined from crack-tip shielding estimates and atomic force microscopy measurements of adhesion between layers that are relevant to organic electronic structures. The interfacial and layer fracture mechanics are elucidated before discussing the implications for the design of robust organic electronic structures.
机译:本文介绍了有机电子结构界面断裂的综合实验和理论研究的结果。使用巴西圆盘样品研究了界面断裂韧度与众数混合的关系。然后将测得的断裂韧性值与由裂纹尖端屏蔽估计值和原子力显微镜检查法确定的与有机电子结构相关的层间粘附力确定的预测值进行比较。在讨论对坚固的有机电子结构设计的意义之前,先阐明了界面和层断裂的力学。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号