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首页> 外文期刊>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems >A new methodology for two-dimensional numerical simulation of semiconductor devices
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A new methodology for two-dimensional numerical simulation of semiconductor devices

机译:半导体器件二维数值模拟的新方法

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摘要

A methodology for obtaining the self-consistent solution of semiconductor device equations discretized in the finite-difference scheme is proposed, in which a new discretized Green's function solution method is used to solve the two-dimensional discretized Poisson equation and a surface mapping technique is developed to treat arbitrary surface boundary conditions. The two-dimensional potential distribution can then be expressed in terms of charge density distribution and bias conditions. Using the derived potential distribution, the SLOR-nonlinear iteration for the current continuity equations of both carriers can be performed by incorporating a new algorithm to obtain the self-consistent solution of a full set of semiconductor device equations without any outer iteration. An Si MESFET simulation demonstrates that the convergent rate of the proposed method can be speeded up to 4-8 times that of Gummel's method. The new method can be incorporated with the conventional solution methods to get a stable and efficient computation scheme.
机译:提出了一种获得有限差分格式离散的半导体器件方程的自洽解的方法,该方法采用了一种新的离散格林函数解法来求解二维离散泊松方程,并开发了一种表面映射技术。处理任意表面边界条件。然后可以根据电荷密度分布和偏置条件来表达二维电势分布。使用导出的电势分布,可以通过合并新算法来获得两个载流子的电流连续性方程的SLOR非线性迭代,从而获得整套半导体器件方程的自洽解,而无需进行任何外部迭代。 Si MESFET仿真表明,该方法的收敛速度可以提高到Gummel方法的4-8倍。新方法可以与常规解决方案方法结合使用,以获得稳定而有效的计算方案。

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