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EffiTest2: Efficient Delay Test and Prediction for Post-Silicon Clock Skew Configuration Under Process Variations

机译:EffiTest2:工艺变化下硅后时钟偏斜配置的有效延迟测试和预测

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摘要

At nanometer manufacturing technology nodes, process variations affect circuit performance significantly. This trend leads to a large timing margin and thus overdesign in the traditional worst-case circuit design How. To combat this pessimism, post-silicon clock tuning buffers can be deployed to balance timing slacks of consecutive combinational paths in individual chips by tuning clock skews after manufacturing. A challenge of this method is that path delays of each chip with timing failures should be measured to gather the information for clock skew configuration. However, current methods for delay measurement rely on path-wise frequency stepping, which requires much time from expensive testers. In this paper, we propose an efficient delay test framework (EffiTest2) to solve the post-silicon testing problem by testing only representative paths with delay alignment using the already-existing tunable buffers in the circuit. Experimental results demonstrate that EffiTest2 can reduce the number of frequency stepping iterations by more than 94% with only a slight yield loss.
机译:在纳米制造技术节点上,工艺变化会显着影响电路性能。这种趋势导致较大的时序裕度,从而在传统的最坏情况下的电路设计How中进行了过度设计。为了消除这种悲观情绪,可以在制造后通过调整时钟偏斜来部署后硅时钟调整缓冲器,以平衡各个芯片中连续组合路径的时序松弛。这种方法的挑战在于,应测量每个芯片的时序延迟和时序故障,以收集信息以用于时钟偏斜配置。但是,当前的延迟测量方法依赖于路径频率步进,这需要昂贵的测试人员花费大量时间。在本文中,我们提出了一种有效的延迟测试框架(EffiTest2),通过使用电路中已经存在的可调缓冲器仅通过延迟对准来测试具有代表性的路径,从而解决了硅后测试问题。实验结果表明,EffiTest2可以将频率步进迭代次数减少94%以上,而产量损失很小。

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