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Antenna-in-Package and Transmit–Receive Switch for Single-Chip Radio Transceivers of Differential Architecture

机译:差分架构单芯片无线电收发器的封装天线和收发收发器开关

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摘要

A fully differential architecture from the antenna to the integrated circuit is proposed for radio transceivers in this paper. The physical implementation of the architecture into truly single-chip radio transceivers is described for the first time. Two key building blocks, the differential antenna and the differential transmit–receive (T–R) switch, were designed, fabricated, and tested. The differential antenna implemented in a package in low-temperature cofired-ceramic technology achieved impedance bandwidth of 2%, radiation efficiency of 84%, and gain of 3.2 dBi at 5.425 GHz in a size of 15$times$15$times$1.6 ${hbox {mm}}^{3}$. The differential T–R switch in a standard complementary metal–oxide–semiconductor technology achieved 1.8-dB insertion loss, 15-dB isolation, and 15-dBm 1-dB power compression point ($P_{1,{hbox {dB}}}$) without using additional techniques to enhance the linearity at 5.425 GHz in a die area of 60$times$40 $mu{hbox {m}}^{2}$.
机译:本文提出了一种从天线到集成电路的全差分架构,用于无线电收发器。首次描述了该架构在真正的单芯片无线电收发器中的物理实现。设计,制造和测试了两个关键构件,即差分天线和差分发射-接收(T-R)开关。采用低温共烧陶瓷技术的封装中实现的差分天线在1524 x 15倍x 16倍的尺寸下在5.425 GHz处实现了2%的阻抗带宽,84%的辐射效率和3.2 dBi的增益。 {mm}} ^ {3} $。标准互补金属氧化物半导体技术中的差分T–R开关实现了1.8dB的插入损耗,15dB的隔离度和15dBm的1dB功率压缩点($ P_ {1,{hbox {dB}} } $),而无需使用其他技术来增强在60 $×40 $ mu {hbox {m}} ^ {2} $的裸片区域中在5.425 GHz处的线性。

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