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Through-wafer optical communication using monolithic InGaAs-on-Si LEDs and monolithic PtSi-Si Schottky-barrier detectors

机译:使用单片InGaAs-on-Si LED和单片PtSi-Si肖特基势垒探测器的晶圆通光通信

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摘要

Through-wafer optical communication has been demonstrated in experiments employing two vertically stacked Si wafers, the upper one with In/sub 0.15/Ga/sub 0.85/As-In/sub 0.15/Al/sub 0.85/As double-heterostructure LEDs (light-emitting diodes) grown by molecular beam epitaxy on its top surface and the lower one with PtSi-Si Schottky-barrier detectors fabricated on its bottom surface. Infrared radiation emitted by the LEDs in a band peaking at 1.12 mu m, just beyond the Si absorption edge, is transmitted through the upper Si wafer, focused with a 25-mm focal-length lens, transmitted through the lower Si wafer, and detected by the Pt-Si detectors. For a single LED-detector pair, the detector signal-to-noise ratio was 10:1 for an LED drive current, of 1 mA at room temperature. The results suggest that through-wafer communication using LEDs and Schottky-barrier detectors is a promising approach for optical interconnects in stacked wafer architectures.
机译:通过使用两个垂直堆叠的Si晶圆的实验已证明了通过晶圆的光通信,上面的一个是In / sub 0.15 / Ga / sub 0.85 / As-In / sub 0.15 / Al / sub 0.85 / As双异质结构LED(光(发射二极管)在其顶表面上通过分子束外延生长,而在其底表面上制造的PtSi-Si肖特基势垒探测器则通过下面的方法生长。 LED发出的红外辐射的峰值在1.12μm处,正好超出Si吸收边缘,该红外辐射穿过上Si晶片,用25 mm焦距透镜聚焦,透射过下Si晶片,并被检测到由Pt-Si探测器。对于一对LED检测器,LED驱动电流的检测器信噪比为10:1,室温下为1 mA。结果表明,使用LED和肖特基势垒探测器进行晶圆间通信是堆叠晶圆架构中光学互连的一种有前途的方法。

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