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首页> 外文期刊>IEEE Journal on Exploratory Solid-State Computational Devices and Circuits >Ferroelectric Field-Effect Transistor-Based 3-D NAND Architecture for Energy-Efficient on-Chip Training Accelerator
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Ferroelectric Field-Effect Transistor-Based 3-D NAND Architecture for Energy-Efficient on-Chip Training Accelerator

机译:基于铁电场效应晶体管的3-D NAND架构,用于节能片上培训加速器

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摘要

Different from the deep neural network (DNN) inference process, the training process produces a huge amount of intermediate data to compute the new weights of the network. Generally, the on-chip global buffer (e.g., SRAM cache) has limited capacity because of its low memory density; therefore, off-chip DRAM access is inevitable during the training sequences. In this work, a novel ferroelectric field-effect transistor (FeFET)-based 3-D NAND architecture for on-chip training accelerator is proposed. The reduced peripheral circuit overheads due to the low operation voltage of the FeFET device and ultrahigh density of 3-D NAND architecture enable storing and computing all the intermediate data on chip during the training process. We present a custom design of a 108-Gb chip with a 59.91-mm(2) area with 45% array efficiency. The relevant data mapping schemes for weights/activations/errors that are compatible with the 3-D NAND architecture are investigated. The training performance was explored, while the ResNet-18 model is trained on this architecture with the ImageNet data set by 8-bit precision. Due to the minimized off-chip memory access, 7.76 TOPS/W of energy efficiency was achieved for 8-bit on-chip training.
机译:与深神经网络(DNN)推断过程不同,训练过程产生大量的中间数据以计算网络的新重量。通常,片上全局缓冲器(例如,SRAM高速缓存)由于其低存储器密度而具有有限的容量;因此,在训练序列期间,片外DRAM访问是不可避免的。在这项工作中,提出了一种用于基于片上训练加速器的基于三维NAND架构的新型铁电场效应晶体管(FEFET)。由于FFET器件的低操作电压和3-D NAND架构的超高密度,降低的外围电路开销能够在训练过程期间存储和计算芯片上的所有中间数据。我们提供了一个108 GB芯片的定制设计,59.91毫米(2)区域,阵列效率为45%。研究了与三维NAND架构兼容的权重/激活/错误的相关数据映射方案。探索了培训表现,而Reset-18型号在此架构上培训,使用8位精度设置的ImageNet数据。由于最小化的芯片内存访问,为8位片上培训实现了7.76个能效的顶部/倍。

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