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Fault coverage and defect level estimation models for partiallytestable MCMs

机译:可部分测试的MCM的故障覆盖率和缺陷级别估计模型

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摘要

The authors propose a simple and efficient mathematical model forndesigners to estimate fault coverage for partially testable multichipnmodules (MCMs). This model shows a relation between fault coverage, testnmethodology, and the fraction and distribution of design for testabilityn(DFT) dies in MCMs. Experimental results show that the proposed modelncan efficiently predict the fault coverage of a partially testable MCMnwith less than 5% deviation. An automatic DFT dies deployment algorithm,nbased on the genetic algorithm and the model is proposed to helpndesigners to obtain a fault coverage as close to the upper bound ofnfault coverage as possible. Two defect level estimation models, whichnrelate fault coverage and manufacturing yield for measuring the testnquality of MCMs under equiprobable and non-equiprobable faults,nrespectively are also formulated and analysed to support theneffectiveness of the model
机译:作者提出了一个简单有效的数学模型,供设计人员估算可部分测试的多芯片模块(MCM)的故障范围。该模型显示了故障覆盖率,测试方法以及MCM中可测试性(DFT)模具设计的分数和分布之间的关系。实验结果表明,所提出的模型可以有效地预测部分可测试的MCMn的故障范围,偏差小于5%。提出了一种基于遗传算法和模型的自动DFT模具部署算法,以帮助设计人员获得尽可能接近故障覆盖范围上限的故障覆盖率。分别建立和分析了两种缺陷水平估计模型,它们分别与故障覆盖率和制造良率相关,用于测量等概率和非等概率故障下MCM的测试质量,以支持该模型的有效性。

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