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Continuous MOSFET performance increase with device scaling: The role of strain and channel material innovations

机译:MOSFET的性能随着器件的扩展而不断提高:应变和沟道材料创新的作用

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摘要

A simple model that links MOSFET performance, in the form of intrinsic switch delay, to effective carrier velocity in the channel is developed and fitted to historical data. It is shown that nearly continuous carrier velocity increase, most recently via the introduction of process-induced strain, has been responsible for the device performance increase commensurately with dimensional scaling. The paper further examines channel material innovations that will be required in order to maintain continued commensurate scaling beyond what can be achieved with process-induced strain, and discusses some of the technological tradeoffs that will have to be faced for their introduction.
机译:开发了一个简单的模型,该模型将MOSFET性能(以固有开关延迟的形式)与通道中的有效载流子速度相关联,并拟合到历史数据中。结果表明,近来连续的载流子速度的增加,最近是通过引入过程引起的应变,已导致器件性能的提高与尺寸缩放相对应。本文进一步研究了通道材料的创新,以保持持续的相对应的规模扩展,以超出过程诱发的应变所能达到的范围,并讨论了引入这些通道时必须面对的一些技术折衷。

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