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Origin and Effects of Negative Ions in the Sputtering of Intermetallic Compounds

机译:金属间化合物的溅射中负离子的起源和影响

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An unexpected etching phenomenon during the sputtering of rare earth-gold alloys has been found to be caused by a large flux of negative gold ions from the sputtering target. We find this effect to occur in a range of intermetallic compounds. A model is presented which predicts when negative ion formation will be important. Effects of negative ions on sputter deposition of thin films include reduced deposition rate or substrate etching, and changes in film composition and other properties. Negative ion formation must also be taken into account for accurate quantitative analysis by Secondary Ion Mass Spectrometry (SIMS).
机译:已经发现,在稀土-金合金的溅射过程中出乎意料的蚀刻现象是由来自溅射靶的大量负金离子引起的。我们发现这种影响发生在一系列金属间化合物中。提出了一个模型,该模型预测何时负离子形成将很重要。负离子对薄膜的溅射沉积的影响包括降低的沉积速率或基板蚀刻,以及膜组成和其他特性的变化。为了通过二次离子质谱(SIMS)进行准确的定量分析,还必须考虑负离子的形成。

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