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Structure of Tunnel Barrier Oxide for Pb-Alloy Josephson Junctions

机译:铅合金约瑟夫森结的隧道势垒氧化物的结构

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The oxide formed on Pb-In and Pb-In-Au alloy films by processes similar to those used to fabricate oxide tunnel barriers for experimental Josephson junction devices has been investigated with transmission electron microscopy and diffraction (TEM/TED), Auger electron and x-ray photoelectron spectroscopies (AES and XPS), and ellipsometry. Thermal oxidation of Pb-In(13 at%) alloys at room temperature results in a noncrystalline oxide, whereas oxides formed at ≥60°C in low pressures of O2 result in a continuous stable epitaxial layer of cubic In2O3 ≈ 2.5 nm thick. The oxide formed by sputtering such a thermal oxide in an rf-excited O2 glow discharge (rf oxidation) results in a layered structure ≈6.5 nm thick, the bulk of which consists of an upper layer of epitaxial In2O3 and a lower layer of crystalline orthorhombic and tetragonal PbO. The thickness of the PbO layer depends on the availability of In at the metal-oxide interface, and thus, on the alloy composition and the temperature and rate of oxidation. For In concentrations above ≈18 at%, the bulk of the oxide was found to be entirely epitaxial In2O3. An additional ≈0.3-nm-thick surface layer of PbO is observed, whi ch arises from material sputtered from the Pb-coated rf electrode and subsequently backscattered onto the surface of the oxide. Altering this backscattered material from lead oxide to indium oxide increases the current densities of completed junctions by more than a factor of 40. In contrast, variations in the composition of the lower portions of the oxide have little effect on the junction characteristics. Factors affecting the composition and reproducibility of the oxide are discussed.
机译:用透射电子显微镜和衍射(TEM / TED),俄歇电子和x研究了通过类似于用于制造约瑟夫森结器件的氧化物隧道势垒的过程在Pb-In和Pb-In-Au合金膜上形成的氧化物。射线光电子能谱法(AES和XPS)和椭偏仪。 Pb-In(13 at%)合金在室温下的热氧化会产生非晶态氧化物,而在O2低压下于≥60°C形成的氧化物会导致立方In2O3≈2.5 nm厚的连续稳定外延层。通过在rf激发的O2辉光放电(rf氧化)中溅射这样的热氧化物而形成的氧化物,形成了≈6.5nm厚的层状结构,其大部分由外延In2O3的上层和晶体正交晶的下层组成和四方PbO。 PbO层的厚度取决于金属氧化物界面上In的可用性,因此取决于合金成分以及温度和氧化速率。对于浓度高于≈18at%的In,发现大部分氧化物完全是In2O3外延的。观察到额外的≈0.3nm厚的PbO表面层,这是由从涂有Pb的rf电极溅射出的材料产生的,随后又反向散射到氧化物的表面。将这种背向散射的材料从氧化铅变为氧化铟,会使完整结的电流密度增加40倍以上。相反,氧化物下部的组成变化对结点特性影响很小。讨论了影响氧化物的组成和再现性的因素。

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