Compact designs, high resolution lead camera module R&D

摘要

Taiwan is strengthening its camera module industry to keep pace with dynamic trends in application sectors. Thinner form factors and higher resolution are at the forefront of product development in lenses, image sensors and backend ICs, which are the key components. Makers are reducing PCB and lens height to create smaller modules for the current set of notebook PCs and mobile phones. Flexible designs such as AzureWave's E2FPC model cut as much as 70 percent of the board's thickness. The resulting PCB measures 0.15mm, down from 0.8mm. The company's product has anti-ESD and -EMI.