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Microstructure variation effects on room temperature fatigue threshold and crack propagation in Udimet 720Li Ni-base superalloy

机译:Udimet 720Li镍基高温合金的组织变化对室温疲劳阈值和裂纹扩展的影响

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An assessment of the effects of microstructure on room temperature fatigue threshold and crack propagation behaviour has been carried out on microstructural variants of U720Li, i.e. as-received U720Li, U720Li-LG (large grain variant) and U720Li-LP (large intragranular coherent γ' variant). Fatigue tests were carried out at room temperature using a 20 Hz sinusoidal cycling waveform at an R-ratio = 0.1 on 12.5 mm × 12.5 mm square cross-section SENB specimens with a 60° starter notch. U720Li-LG showed the highest threshold ΔK (ΔK_(th)), whilst U720Li-LP showed the lowest ΔK_(th) value. U720Li-LP also showed higher crack growth rates in the near-threshold regime and at high ΔK (although at higher ΔK levels the difference was less marked). Crack growth rates of U720Li and U720Li-LG were relatively similar both in the near-threshold regime and at high ΔK. The materials showed crystallographic stage I type crack growth in the near-threshold regime, with U720Li showing distinct crystallographic facets on the fracture surface, while U720Li-LG and U720Li-LP showed mostly microfacets and a lower proportion of large facets. At high ΔK, crack growth in the materials becomes flat and featureless indicative of stage II type crack growth. The observed fatigue behaviour, which is an effect of the combined contributions of intrinsic and extrinsic crack growth resistances, is rationalized in terms of the microstructural characteristics of the materials. Enhanced room temperature fatigue threshold and near-threshold long crack growth resistance are seen for materials with larger grain size and higher degree of planar slip which may be related to increased extrinsic crack growth resistance contributions from crack tip shielding and roughness-induced crack closure. Differences in the deformation behaviour, either homogeneous or heterogeneous due to microstructural variation in this set of materials may provide approximately equivalent intrinsic crack growth resistance contributions at room temperature.
机译:已经对U720Li的微观结构变体(即原样的U720Li,U720Li-LG(大晶粒变体)和U720Li-LP(大颗粒内相干γ'))进行了微观结构对室温疲劳阈值和裂纹扩展行为的影响评估。变体)。在室温下使用20 Hz正弦循环波形在R比率= 0.1上对具有60°起动器缺口的12.5 mm×12.5 mm方形截面SENB样品进行疲劳测试。 U720Li-LG显示最高阈值ΔK(ΔK_(th)),而U720Li-LP显示最低阈值ΔK_(th)。 U720Li-LP在接近阈值和高ΔK时也显示出较高的裂纹扩展速率(尽管在较高ΔK时差异不明显)。 U720Li和U720Li-LG的裂纹增长率在近阈值状态和高ΔK时都相对相似。这些材料在接近阈值状态下表现出I型晶体裂纹扩展,U720Li在断口表面显示出明显的晶面,而U720Li-LG和U720Li-LP则大部分表现为微晶面,而较小的大晶面比例较低。在高ΔK时,材料中的裂纹扩展变得平坦且无特征,表明阶段II型裂纹扩展。根据材料的微观结构特征,合理观察到的疲劳行为是内在和外在的裂纹增长阻力共同作用的结果。对于具有较大晶粒尺寸和较高的平面滑移度的材料,可以看到增强的室温疲劳阈值和接近阈值的长时间裂纹扩展性,这可能与裂纹尖端屏蔽和粗糙度引起的裂纹闭合所增加的外部裂纹扩展性的贡献有关。由于这组材料的微观结构变化而导致的变形行为的差异(均质或异质)在室温下可提供近似等效的固有抗裂纹扩展性。

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